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September 20-21, 2016 Computer History Museum Mountain View, California http://www.semi.org/en/node/41386 The theme for this year’s Strategic Materials Conference (SMC) is Scaling Challenges: The Future of Materials and Packaging. What is driving the demand for new materials? How will material suppliers be impacted? How does this effect the future of scaling for materials and packaging? Please…
Click Here to Read MoreJuly 12-14, 2016 Moscone Center San Francisco, California SEMICON West is an annual event built around keeping up with the latest disruptive trends driving today’s market. This event brings major industry leaders and emerging players together in one place. This is where we go to see our vendors, competitors, customers, and everyone in between.…
Click Here to Read MorePresentation Friday, June 3rd · 2:20PM Session 36: 3D materials & Processing Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material" Alain Phommahaxay, Goedele Potoms, Greet Verbinnen, Erik Sleeckx, Gerald Beyer, and Eric Beyne – IMEC; Alice Guerrero, Dongshun Bai, Xiao Liu, Kim Yess, and Kim Arnold – Brewer…
Click Here to Read MoreCompound Semiconductor Manufacturing 2016 See the next generation of temporary bonding equipment and thin wafer handling technology for SiC and compound semiconductor at the Brewer Science 2016 CS Mantech booth. On display in the booth will be the new Cee® Apogee™ temporary bonding equipment suite designed with the DataStream™ Technology. Ram Trichur and Matt Ziegler…
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