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2025 IWLA Convention & Expo

2025 IWLA Convention & Expo. Visit Brewer Science at Booth #62. Learn More

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CMC 2025

Dr. Andrea Chacko will present Temporary Materials for Chiplet Integration at CMC 2025 in Austin, Texas. View Agenda

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Integration Engineering and Novel Underlayers Presented at SPIE Advanced Lithography + Patterning 2025

Integration Engineering and Novel Underlayers Presented at SPIE Advanced Lithography + Patterning 2025 Keynote presentation addresses architecture and design impacts on lithography scaling challenges   San Jose, California – February 20, 2025 – Brewer Science, Inc., an industry pioneer in advanced lithography and patterning innovation, will present its ground-breaking developments in addressing scaling challenges at…

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SPIE AR VR MR 2025

SPIE AR VR MR 2025 Materials for next-generation optical devices with high transmission presented by Reuben Chacko   Event: SPIE AR VR MR 2025 Location: San Francisco, California Conference Center: The Moscone Center West   Presentation: Materials for next-generation optical devices with high transmission Speaker: Reuben Chacko, PhD Date: January 27 – 29, 2025 Time:…

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Hybrid Bonding Symposium hosted by IEEE

Hybrid Bonding Symposium hosted by IEEE Materials for Hybrid Bonding presented by Andrea Chacko   Event: Hybrid Bonding Symposium hosted by IEEE Location: Silicon Valley, California Conference Center: SEMI World Headquarters 673 South Milpitas Blvd, Milpitas, CA USA   Presentation: Materials for Hybrid Bonding Speaker: Andrea Chacko, PhD Date: January 16 – 17, 2025 Time:…

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The Lithography Workshop 2024

Dougal Guerrero, Ph.D. will present "New materials towards sustainable manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.

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Brewer Science presents Materials Innovation for Additive Electronics at InterPACK 2024

Brewer Science presents Materials Innovation for Additive Electronics at InterPACK 2024 Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing   San Jose, California – October 2, 2024 – Brewer Science, Inc., a global leader in advancing innovative materials needed for additive electronics, is presenting Building Circuits from the Ground Up:…

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Brewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE

Brewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE Achieving High-Volume, Zero-Defect Quality Polymer Purification   San Diego, CA – October 23, 2024 – Brewer Science, Inc., a high-volume manufacturer of ultrapure semiconductor materials, is presenting their latest innovation in polymer purification at the AIChE Conference from October 27th through 31st. Traditional Batch…

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Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing

Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing.   Taipei, Taiwan – August 28, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the…

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Materials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024

Materials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024 Experience higher integration density and improved performance through hybrid bonding techniques.   Boston, MA –  September 24, 2024 – Brewer Science, Inc., a pioneer in temporary bonding and   materials for the semiconductor industry, is presenting Materials for Hybrid Bonding at IMAPS Symposium 2024…

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