Imec reports for the first time direct growth of 2D materials on 300mm wafers
December 06, 2018Press Release
Release Originally Posted on IMEC's website here: https://www.imec-int.com/en/articles/imec-reports-for-the-first-time-direct-growth-of-2d-materials-on-300mm-wafers SAN FRANCISCO (USA), DECEMBER 3, 2018 — This week, at the 2018 IEEE International Electron Devices Meeting (IEDM), imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, presents a 300mm-wafer platform for MOSFET devices with 2D materials. 2D materials could provide the path towards…
Local Missouri Manufacturers Invite All to Manufacturing Day
October 02, 2018Press Release
Rolla, Mo.– Oct. 2, 2018 – Brewer Science is pleased to invite the public to learn more about Rolla manufacturers by attending a Manufacturing Day Exhibition on Oct. 9 between the hours of 9 a.m. and 4 p.m. The event will be held in the Chat Conference Room at Brewer Science, located at 2401 Brewer…
Brewer Science Hosts 2018 Pure Enjoyment Art Exhibit and Reception at Creamery Arts Center in Springfield, Missouri
September 26, 2018Press Release
Springfield, Mo.– Sept. 26, 2018 – Brewer Science, in cooperation with the Springfield Regional Arts Council and Arts Rolla, will host an exhibit of original art and photography from Oct. 5 through Oct. 26 at the Creamery Arts Center, located at 411 N. Sherman Parkway in Springfield, MO. “Pure Enjoyment,” a juried exhibit, will feature…
Brewer Science Unveils BrewerBOND® Dual-Layer Temporary Bonding System and BrewerBUILD™ Material for RDL-First Fan-Out Packaging
September 04, 2018Press Release
Rolla, Missouri – Sept. 3, 2018 – Brewer Science, Inc. today, from SEMICON Taiwan 2018, introduced the latest additions to its industry-leading BrewerBOND® family of temporary bonding materials, as well as the first product in its new BrewerBUILD™ line of thin spin-on packaging materials. BrewerBUILD delivers an industry-first solution to address manufacturers’ evolving wafer-level packaging…
Berlin’s Jacques Thibaud String Trio Visits Rolla, Missouri
August 28, 2018Press Release
Rolla, Missouri – On August 18, 2018, Brewer Science hosted the Jacques Thibaud Trio for an evening of modern and classic chamber music at the Cedar Street Playhouse. The Jacques Thibaud String Trio has been coming to the Ozarks for almost two decades to share modern and classical string trio music. The group, founded at…
SEMICON Europa 2018
November 13 - November 16, 2018Event
November 13-16, 2018 Messe München Munich, Germany Brewer Science will attend SEMICON Europa in Munich to talk about the latest innovations in the microelectronics industry. SEMICON Europa attracts a highly influential audience from every segment and sector of the European microelectronics industries including semiconductors, LEDs, MEMS, printed/organic/flexible, and other adjacent markets. Brewer Science continues…
International Symposium on DSA
November 11 - November 13, 2018Event
November 11-13, 2018 Sapporo Park Hotel Sapporo, Japan Brewer Science will attend the 4th International Symposium on DSA in Sapporo, Japan. Directed self-assembly (DSA) is rapidly advancing as a potential patterning solution for advanced lithography. The 4th International Symposium on DSA will be organized as a collaborative effort between EIDEC, imec, CEA-Leti, and…
MEMS & Sensors Executive Congress (MSEC)
October 28 - October 30, 2018Event
October 28-30, 2018 Silverado Resort and Spa Napa, CA Brewer Science will attend and speak at MEMS & Sensors Executive Congress (MSEC), an event that provides great opportunities to highlight your expertise before executives from across the industry’s extended value chain. Join us at the event to continue learning about the global MEMS…
IWLPC 2018
October 23 - October 25, 2018Event
October 23-25, 2018 DoubleTree by Hilton San Jose San Jose, CA Brewer Science will attend the 15th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. Addressing wafer-level packaging, 3D,…
International Microelectronics Assembly and Packaging Society
October 08 - October 11, 2018Event
October 8-11, 2018 Pasadena Convention Center Pasadena, CA Brewer Science will attend the 51st International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS). This year IMAPS has rolled out a new technical program that has been organized to help attendees find their key interests faster by defining 5…
