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Dr. Andrea Chacko will present Temporary Materials for Chiplet Integration at CMC 2025 in Austin, Texas. View Agenda
April 8 - 10, 2025 Event Read MoreIntegration Engineering and Novel Underlayers Presented at SPIE Advanced Lithography + Patterning 2025 Keynote presentation addresses architecture and design impacts on lithography scaling challenges San Jose, California – February…
Read MoreSPIE AR VR MR 2025 Materials for next-generation optical devices with high transmission presented by Reuben Chacko Event: SPIE AR VR MR 2025 Location: San Francisco, California Conference Center:…
Read MoreBrewer Science will be exhibiting at booth #518 at SEMIEXPO Heartland. More information can be found in our press release. April 1–2, 2025 Indiana Convention Center 100 S. Capitol Ave.…
Read MoreHybrid Bonding Symposium hosted by IEEE Materials for Hybrid Bonding presented by Andrea Chacko Event: Hybrid Bonding Symposium hosted by IEEE Location: Silicon Valley, California Conference Center: SEMI World…
Read MoreInnovation in hybrid bonding and laser debonding presented at EPTC in Singapore 3D Packaging and Thin Wafer Processing Research Co-Presented by Brewer Science Singapore – December 2, 2024 –…
Read MoreDougal Guerrero, Ph.D. will present "New materials towards sustainable manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.
Read MoreMulti-Tier Die Stacking Enables Efficient Manufacturing Achieve higher integration density with collective die-to-wafer bonding Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing…
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