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The Vichy Volunteer Fire Department has achieved an ISO classification of 5 for the Rolla National Airport at Vichy. This means that businesses located there could see a reduction in…
February 12, 2019 Press Release Read MoreRelease Originally Posted on IMEC's website here: https://www.imec-int.com/en/articles/imec-reports-for-the-first-time-direct-growth-of-2d-materials-on-300mm-wafers SAN FRANCISCO (USA), DECEMBER 3, 2018 — This week, at the 2018 IEEE International Electron Devices Meeting (IEDM), imec, the world-leading research…
Read MoreSince our inception, Brewer Science has been strongly committed to cultivating diversity. And we do so for one primary reason: a broad range of backgrounds leads to better ideas…
Read MoreThin-wafer processing trends Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires…
Read MoreDeveloping photosensitive film layers to produce features of targeted sizes is a critical process step within any photolithography application. Application engineers have created several processes for performing this step with…
Read MoreThe microelectronics industry is rapidly migrating to fabricating 3-D wafer stacking interconnects using through-silicon via (TSV) technology. Major market segments seeking to benefit from TSV technology include advanced packaging for…
Read MoreIn addition to precisely controlling application of the materials that enable wafer bonding, a solvent-enriched sealed spin chamber contributes to process integrity. One of the most critical variables in achieving…
Read MoreThermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage…
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