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In previous posts, we’ve made references to Moore’s law and how, with uncanny accuracy, it has predicted that the number of transistors in a dense integrated circuit (IC) would double…
February 15, 2017 Blogs Read MoreMultilayer technology from Brewer Science has allowed the industry to continue to push the limits of advanced lithography well into the future. Our experts explain why it was needed and…
Read MoreProTEK® Materials Highly oleophobic and hydrophobic transparent scratch-resistant coating.
Read MoreWhy do we need temporary bonding technology? Ram Trichur is back to discuss how temporary wafer bonding technology allows IC manufacturers to safely handle ultra-thin wafers during advanced processing and…
Read MoreWhat is "Fan-out Wafer-Level Packaging"? Fan-out wafer-level packaging (FOWLP) has been described as a game changer by industry experts because of its thin form factor, low cost of ownership, and…
Read MoreFebruary 15- 17, 2017 Tokyo, Japan Brewer Science is co-exhibiting with OE-A (Organic and Printed Electronics Association). Booth: 6B-28 Conference Website
Read MoreJanuary 19, 2017 – Belle, MO – Brewer Science is investing in the innovators of tomorrow by promoting opportunities for learning more about science, technology, engineering, and math (STEM) in…
Read MoreNew Report by President’s Council of Advisors on Science and Technology Reinforces Need for Greater Competition with China January 17, 2017 – Rolla, MO - Brewer Science is supporting the…
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