SEMICON Japan 2017


Event
December 13-15, 2017 Booth: 3209 Tokyo, Japan SEMICON Japan: Semiconductor, Wafer-Level Packaging Tokyo, Japan For more information contact us at info@brewerscience.com or fill out the below form: For more information: Conference Website

Brewer Science Quadruples Commitment to Printed Sensor Systems Research at Jordan Valley Innovation Center


Press Release
December 20, 2017 – Springfield, MO - Brewer Science is quadrupling its research operations at Missouri State University’s Roy Blunt Jordan Valley Innovation Center (JVIC) located in Springfield, Missouri. The expansion brings the total footprint at JVIC to approximately 20,000 square feet. “Our researchers continue to lead the way in new discoveries and innovation in…

EPTC 2017


Event
December 6-9, 2017 Singapore, Grand Copthorne Waterfront Hotel Brewer Science’s Ram Trichur, Business Development Director, to present an invited talk at EPTC: Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes Location: Swallow Room Friday, December 8, 2017 8:30-9:00 am Ram is also moderating the Material and Processing session: Session: S-09, Material and Processing Location: Lyrebird…

3D ASIP


Event
Tuesday, December 5, 2017 San Francisco, CA, USA   Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer Handling in an invited talk at 3D ASIP: Tuesday, December 5, 2017 SESSION 3 Equipment & Materials 5:00pm-5:20pm Check out the program agenda here. 3D…

Brewer Science Hosts 2017 Pure Enjoyment Art Exhibit and Reception at Creamery Arts Center in Springfield, Missouri


Press Release
October 3rd, 2017 – Springfield, MO - Brewer Science, in cooperation with the Springfield Regional Arts Council and Arts Rolla, will host an exhibit featuring original art and photography at the Creamery Arts Center during the month of October. “Pure Enjoyment,” a juried exhibit, will feature 121 works of original art, photography, and dimensional art…

AVS International Symposium & Exhibition


Event
October 29-November 2, 2017 Tampa, FL Don’t miss our presentation Materials and Methods for Bottom-Up Semiconductor Device Manufacturing by Selective Surface Modification, Reuben Chacko, J. Lowes, J. Dai, S. Brown, D. Sweat, Brewer Science, Inc. 2D Materials Poster Session, November 2, 2017, 6:30 PM Abstract: In order to extend Moore's Law, device makers are looking…

IWLPC (International Wafer-Level Packaging Conference)


Event
October 24-26, 2017 San Jose, CA Double Tree by Hilton San Jose Attend our presentation at Wafer Level Packaging (WLP) Processes Session 4 The Dual-layer Bonding Platform as A Technical Enabler for Wafer-Level Packaging Applications Tuesday, October 24, 2017, 1:00-3:00 pm (Oak) Xiao Liu, Ph.D., Brewer Science Inc Author(s):        Xiao Liu, Qi Wu, Dongshun Bai,…

IMAPS


Event
October 9-12, 2017 Raleigh, NC Attend our joint paper with SUSS MicroTec Ablative Laser Patterning of Polymeric Dielectric Materials Author(s): Cristina Matos, Brewer Science, Inc. (Deborah Blumenshine, Lisa Kirchner, Rama Puligadda; Brewer Science, Inc.; Habib Hichri, Seongkuk Lee, Markus Arendt, Suss MicroTec Group) Wednesday, October 11, 2017, 8:30-8:55 am Abstract: Advances in the research and…

I3S (5th International Symposium on Sensor Science)


Event
September 27-29, 2017 Barcelona, Spain   Don’t miss the opportunity to attend our Sensors Applications session presentation Sensor Excitation and Measurement Techniques for CNT Thin-Film Sensors Louis McCarthy, Brewer Science Friday, September 29, 2017, 15:45 – 16:00 Abstract: Extracting meaningful data from a high-noise EMI environment can present a challenging task. Converters, line-noise, and high-speed…

Sensor Expo Japan 2017


Event
September 13-15, 2017 Tokyo, Japan     Sensor Expo Japan: Printed Electronics Tokyo Big Sight - East Hall Organizer: Fuji Sankei Business i. (The Nihon Kogyo Shimbun Co., Ltd.) Special Sponsor: Japan Society of Next Generation Sensor Technology Schedule a time to meet at the conference or ask a question about a featured product: For…

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