Dr. Terry Brewer’s discovery of anti-reflective coatings resulted in a revolution in the global microelectronics industry and ushered in today’s high-speed, lightweight electronic devices.
Learn MoreAdvanced materials for the protection and enhancement of optics, displays, and other microelectronics.
Learn MoreOur line of products stretches across the whole spectrum of lithography wavelengths and is the most comprehensive product lineup in the industry.
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Learn MoreBrewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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May 25, 2017 – Taipei, Taiwan - Brewer Science invites you to join us at COMPUTEX TAIPEI 2017 to preview new technology that will enable Smart Cities. COMPUTEX TAIPEI 2017…
May 24, 2017 Press Release Read MoreApril 19. 2017 – Rolla & Vichy, MO – Brewer Science is pleased to announce the achievement of Zero Waste to Landfill Certification for the second consecutive year. GreenCircle Certified,…
Read MoreApril 17, 2017 – Wuxi, China– Brewer Science invites you to join us April 21 for the Advanced Packaging & System Integration Technology Symposium in Wuxi, China. Organized by Yole…
Read MoreFebruary 13, 2017 – Tokyo, Japan – Brewer Science invites you to join them February 15 through February 17 at Printable Electronics Japan 2017, a part of the Converting Technology…
Read MoreFebruary 10, 2017 – San Jose, CA – Brewer Science invites you to join us February 26 through March 2 at SPIE Advanced Lithography in San Jose, CA, as we…
Read MoreJanuary 19, 2017 – Belle, MO – Brewer Science is investing in the innovators of tomorrow by promoting opportunities for learning more about science, technology, engineering, and math (STEM) in…
Read MoreNew Report by President’s Council of Advisors on Science and Technology Reinforces Need for Greater Competition with China January 17, 2017 – Rolla, MO - Brewer Science is supporting the…
Read MoreDecember 07, 2016 – San Francisco, CA – Brewer Science is pleased to announce that Dr. Dongshun Bai, Senior Program Manager, will be speaking on new temporary wafer bonding technology…
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