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Permanent Bonding Materials

PermaSOL® Materials PermaSOL® materials address a range of needs identified for permanent bonding applications, which include low-temperature bonding, excellent chemical resistance, thermally curable bonding process and no material movement after the bonding process. Talk to An Expert Today

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WaferBOND® HT-10.11 Material

WaferBOND® HT-10.11 Material WaferBOND® HT-10.11 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment. WaferBOND® HT-10.11 material is an organic coating developed for temporary wafer bonding solutions for MEMS and 3-D wafer-level packaging applications. WaferBOND® HT-10.11 material enables effective bonding and support through substrate thinning and backside standard lithographic processing…

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BrewerBOND® T1100/C1300 Series Materials

BrewerBOND® T1100/C1300 series materials enable our unique VersaLayer solution for high-temperature and high-stress applications found within the semiconductor industry. BrewerBOND® T1100/C1300 Series Material Benefits VersaLayer system with high-Tg thermoplastic and curable material Mechanical stability, no movement of bonding material, and thermal stability ≤ 400°C Low-temperature bonding (≤ 25°C) Increased throughput Increased adhesion at all interfaces…

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Packaging Solutions

Next Generation Packaging Solutions Brewer Science is revolutionizing packaging with innovative thin wafer handling (TWH) technologies. Our diverse set of high-performance materials allow for higher throughput, reduction in form factor, and lower cost. We work with leading equipment vendors to provide fully automated solutions for high-volume needs. Talk to an Expert Today

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