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PermaSOL® Materials PermaSOL® materials address a range of needs identified for permanent bonding applications, which include low-temperature bonding, excellent chemical resistance, thermally curable bonding process and no material movement after the bonding process. Talk to An Expert Today
Click Here to Read MoreWaferBOND® HT-10.11 Material WaferBOND® HT-10.11 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment. WaferBOND® HT-10.11 material is an organic coating developed for temporary wafer bonding solutions for MEMS and 3-D wafer-level packaging applications. WaferBOND® HT-10.11 material enables effective bonding and support through substrate thinning and backside standard lithographic processing…
Click Here to Read MoreBrewerBOND® T1100/C1300 series materials enable our unique VersaLayer solution for high-temperature and high-stress applications found within the semiconductor industry. BrewerBOND® T1100/C1300 Series Material Benefits VersaLayer system with high-Tg thermoplastic and curable material Mechanical stability, no movement of bonding material, and thermal stability ≤ 400°C Low-temperature bonding (≤ 25°C) Increased throughput Increased adhesion at all interfaces…
Click Here to Read MoreNext Generation Packaging Solutions Brewer Science is revolutionizing packaging with innovative thin wafer handling (TWH) technologies. Our diverse set of high-performance materials allow for higher throughput, reduction in form factor, and lower cost. We work with leading equipment vendors to provide fully automated solutions for high-volume needs. Talk to an Expert Today
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