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Thermally curable middle layer for 193-nm trilayer resist process

New lithographic compositions, for use as middle layers in trilayer processes  resist processes can be applied as very thin films with a very thin layer of photoresist being applied to the top of the middle layer. Thus, the underlying bottom anti-reflective coating is still protected even though the overall stack (i.e., anti-reflective coating plus middle…

  trilayer, trilayer resist process, lithographic, lithographic composition, anti-reflective coating, 193-nm, unilayer processing, depth-of-focus, Lithography Click Here to Read More