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Thermal slide debonding for temporary bonding processes (Part 3 of 3)

Thermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage originate during upstream bonding material coating, curing, bonding, and thinning processes. Moreover, only thermal separation tools that are highly precise and highly accurate will consistently…

  Wafer-Level packaging, debonder, thin wafer handling, spincoat, 3D packaging Click Here to Read More

Thin-wafer handling: Spin chuck designs for thinned substrates

Thin-wafer processing trends Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires specially designed spin chucks and thin-wafer handling techniques. The substrates are made of a wide array of materials, and some of the more popular ones…

  thin wafer handling, 3D packaging, spin coat, LED manufacturing, Wafer-Level packaging Click Here to Read More

Supply chain flexibility for 3D device packaging

Limitations of Moore's Law Ultimately, performance of computers and other electronic products will be limited by transistor size and density. Because the semiconductor industry has pushed to create ever-smaller features with photolithography, engineers have been able to shrink transistors far beyond original expectations to dramatically increase the density of transistors on a chip, thereby enabling…

  supply chain, 3D packaging Click Here to Read More