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A Technical Guide to Selecting a Photosensitive Permanent Bonding Material

Nine Essential Criteria to Achieve a Successful Bonding Process A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we…

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Hybrid Bonding Basics – What is Hybrid Bonding?

Advanced packaging requires pitches below 10 µm. Hybrid bonding is the key to paving an innovative future in advanced packaging. Hybrid bonding provides a solution that enables higher bandwidth and increased power and signal integrity. As the industry looks to enhance device performance by scaling system-level interconnections, hybrid bonding provides the most promising solution with…

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