Dr. Terry Brewer’s discovery of anti-reflective coatings resulted in a revolution in the global microelectronics industry and ushered in today’s high-speed, lightweight electronic devices.
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Advanced packaging requires pitches below 10 µm. Hybrid bonding is the key to paving an innovative future in advanced packaging. Hybrid bonding provides a solution that enables higher bandwidth and increased power and signal integrity. As the industry is looking to enhance the performance of final devices through scaling system-level interconnections, hybrid bonding provides the…
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