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Thin-wafer handling: Spin chuck designs for thinned substrates

Thin-wafer processing trends Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires specially designed spin chucks and thin-wafer handling techniques. The substrates are made of a wide array of materials, and some of the more popular ones…

  thin wafer handling, 3D packaging, spin coat, LED manufacturing, Wafer-Level packaging Click Here to Read More

Protecting key device features during wet-etch processing

With the explosion in demand for devices that include features in the tens to hundreds of microns, wet-etching is seeing new relevance. Light-emitting diodes (LED), microfluidic devices, ink-jet printer heads, sensors, and many other devices are being mass produced in semiconductor-fab-like environments. However, these feature sizes often do not demand the precision, of plasma etching,…

  DRIE, GaN roughening, etch protection, wet etching, LED manufacturing Click Here to Read More
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