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Process methodologies for temporary thin wafer handling solutions

Use of temporary bonding/debonding as part of thin wafer handling processes is rapidly increasing. Users must determine which temporary bonding/debonding method is appropriate for a specific application. Some of the technologies that have been developed are chemical release, thermal slide separation, and ZoneBOND® debonding. The chemical release process requires very little force to release the…

  thermal slide debonding, temporary bonding materials, thin wafer handling, ZoneBOND, Wafer-Level packaging Click Here to Read More

What is temporary bonding and why is it needed?

What makes it possible for our smartphones, tablets, gaming systems, networking devices, and everyday electronics to operate at faster speeds, process more information, and continue to shrink in size? Until now, the answer has included a number of advanced technologies and processes that have allowed the microelectronics industry to double the number of circuits in…

  Wafer-Level packaging, temporary bonding materials, thin wafer handling Click Here to Read More

How can glass survive rigorous back end processes?

Brewer Science is headed to the CS ManTech conference May 18 through 21!  CS ManTech is a respected organization focused on providing a forum for members of the compound semiconductor community to exchange and discuss new ideas. At this year's conference, we’re excited to share our findings regarding the ability of glass to be used…

  CTE, CSAM, CS Mantech, Wafer-Level packaging, Corning, temporary bonding materials, back-end processes Click Here to Read More