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Bake plate enhancements for optimal thick-film curing results

High-uniformity bake plates have been displacing convection ovens for well over two decades in the microelectronics industry. The disadvantages of variable temperature zones, lengthened cure times, and considerable particle contamination have been thoroughly analyzed and confirmed. Although temperature uniformity remains the primary advantage for precision hot plates, virtually eliminating skinning effects for thin-film (< 1-5…

  other, coat uniformity, thick-film Click Here to Read More

Solvent vapor control for optimal thick-film spin coating

One of the most critical variables in spin-coating processes is coating uniformity. In many cases, engineers are challenged with achieving ultralow total thickness variation at high film thicknesses while conserving expensive materials. To achieve such a highly uniform coating, automated control of the solvent vapors is essential. A closed bowl environment combined with a programmable…

  coat uniformity, thick-film, spin coat, Wafer-Level packaging Click Here to Read More