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Process methodologies for temporary thin wafer handling solutions

Use of temporary bonding/debonding as part of thin wafer handling processes is rapidly increasing. Users must determine which temporary bonding/debonding method is appropriate for a specific application. Some of the technologies that have been developed are chemical release, thermal slide separation, and ZoneBOND® debonding. The chemical release process requires very little force to release the…

  ZoneBOND, Wafer-Level packaging, thermal slide debonding, temporary bonding materials, thin wafer handling Click Here to Read More

What is temporary bonding and why is it needed?

What makes it possible for our smartphones, tablets, gaming systems, networking devices, and everyday electronics to operate at faster speeds, process more information, and continue to shrink in size? Until now, the answer has included a number of advanced technologies and processes that have allowed the microelectronics industry to double the number of circuits in…

  Wafer-Level packaging, temporary bonding materials, thin wafer handling Click Here to Read More

Thermal slide debonding for temporary bonding processes (Part 3 of 3)

Thermal slide debonding represents the next significant advancement in obtaining high-yield thin wafer results. Initial detection of anomalies and cracks usually occurs during debonding; however, many causes for this damage originate during upstream bonding material coating, curing, bonding, and thinning processes. Moreover, only thermal separation tools that are highly precise and highly accurate will consistently…

  Wafer-Level packaging, debonder, thin wafer handling, spincoat, 3D packaging Click Here to Read More

Thin-wafer handling: Spin chuck designs for thinned substrates

Thin-wafer processing trends Several spin-coating process applications require the ability to uniformly coat, develop, and/or rinse (clean) thinned and fragile substrates. Safely handling these fragile materials is paramount and requires specially designed spin chucks and thin-wafer handling techniques. The substrates are made of a wide array of materials, and some of the more popular ones…

  thin wafer handling, 3D packaging, spin coat, LED manufacturing, Wafer-Level packaging Click Here to Read More