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Processing wafers with high-topography 3-D structures

Over the past decade, Brewer Science has developed and published various methods of creating a planar surface over three-dimensional (3-D) structures. Sharing these results invariably leads to a potential customer asking, “Can you fill the holes in my substrate that are x in size?” The short answer to the question is “Yes, we can.” Filling…

  TSV, Wafer-Level packaging, planarization Click Here to Read More