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Innovation in hybrid bonding and laser debonding presented at EPTC in Singapore 3D Packaging and Thin Wafer Processing Research Co-Presented by Brewer Science Singapore – December 2, 2024 – Brewer Science, Inc., an industry leader in advanced packaging materials for semiconductor manufacturing, will present its latest research developing the next-generation of 3D packaging materials…
Click Here to Read MoreDougal Guerrero, Ph.D. will present "New materials towards sustainable manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.
Click Here to Read MoreMulti-Tier Die Stacking Enables Efficient Manufacturing Achieve higher integration density with collective die-to-wafer bonding Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die stacking and hybrid bonding, enable increased integration density, therefore improving yield of high-quality devices. However, these…
Click Here to Read MoreBrewer Science Elevates Two Corporate Leaders to Chief Executive Role Corporate leadership developments to drive projected growth and innovation Rolla, MO – October 10, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials used to advance next-generation computing technologies, is elevating two senior leaders to co-chief executive. This change will…
Click Here to Read MoreBrewer Science presents Materials Innovation for Additive Electronics at InterPACK 2024 Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing San Jose, California – October 2, 2024 – Brewer Science, Inc., a global leader in advancing innovative materials needed for additive electronics, is presenting Building Circuits from the Ground Up:…
Click Here to Read MoreBrewer Science Elevates Veteran Leader and Welcomes New Market Strategy Officer to Propel Future Growth in Semiconductor Industry Corporate leadership developments to drive projected growth and innovation Rolla, MO – September 11, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials used to advance next-generation computing technologies, is elevating…
Click Here to Read MoreBrewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE Achieving High-Volume, Zero-Defect Quality Polymer Purification San Diego, CA – October 23, 2024 – Brewer Science, Inc., a high-volume manufacturer of ultrapure semiconductor materials, is presenting their latest innovation in polymer purification at the AIChE Conference from October 27th through 31st. Traditional Batch…
Click Here to Read MoreFive Questions to Ask When Selecting a Temporary Bonding and Debonding System Thin-wafer handling requires strategic material selection High-bandwidth memory blocks (HBM) memory, microprocessors, field-programmable gate arrays (FPGA), AI accelerators, and other devices used in advanced system-level packaging all rely on temporary bonding and debonding systems to shrink their footprint. Understanding which properties play…
Click Here to Read MoreBrewer Science Achieves Certified B Corporation™ Recertification Certified B Corporation™ recertification and 2024 Impact Report accredit commitment to positive impact. Rolla, MO – July 31, 2024 – Brewer Science, Inc., a global leader in semiconductor innovation, is thrilled to announce its recertification as a Certified B Corporation™. This achievement underscores Brewer Science's steadfast commitment…
Click Here to Read MoreBrewer Science Named 2024 National Top Workplace in Manufacturing Industry Work-life balance and supportive managers among top culture drivers identified Rolla, MO – July 15, 2024 - Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2024 National Top…
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