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Brewer Science to Showcase Advanced Packaging Materials and Technologies at ECTC 2026 Orlando, Florida – May 18, 2026 — Brewer Science, Inc., a global leader in materials innovation for advanced packaging and semiconductor manufacturing, will be exhibiting and presenting at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), taking place May 26–29, 2026,…
Event Read MoreSPIE AR VR MR 2025 Materials for next-generation optical devices with high transmission presented by Reuben Chacko Event: SPIE AR VR MR 2025 Location: San Francisco, California Conference Center:…
Read MoreHybrid Bonding Symposium hosted by IEEE Materials for Hybrid Bonding presented by Andrea Chacko Event: Hybrid Bonding Symposium hosted by IEEE Location: Silicon Valley, California Conference Center: SEMI World…
Read MoreDougal Guerrero, Ph.D. will present "New materials towards sustainable manufacturing" at The Lithography Workshop 2024 in San Deigo, California on November 5th at 11:50AM PST.
Read MoreBrewer Science Presents Scalable, High-Purity Solutions for Semiconductor Manufacturing at AIChE Achieving High-Volume, Zero-Defect Quality Polymer Purification San Diego, CA – October 23, 2024 – Brewer Science, Inc., a…
Read MoreMaterials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024 Experience higher integration density and improved performance through hybrid bonding techniques. Boston, MA – September 24, 2024 –…
Read MoreBrewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing. Taipei, Taiwan –…
Read MoreEXPLORE VIRTUAL ART GALLERY 2025 Schedule: July 1st - August 22nd (midnight): Submit Entries Online September 5th: Notification of Acceptance to in-person portion Sept 25th - 26th: Bring accepted…
Read MoreImplementation of New Materials and Printed Electronics for Monitoring the Environment Brewer Science, a pioneer in printed electronics and smart device technology, invites all attendees of ‘The Future of Electronics…
Read MoreBrewer Science Co-presents Low-Temperature Hybrid Bonding Breakthroughs at ECTC Experience higher integration density and improved performance through hybrid bonding techniques. Denver, Colorado – May 23, 2024 – Brewer Science,…
Read MoreBrewer Science Presents Innovative Material Solutions for Compound Semiconductor Manufacturing at CS Mantech. Tucson, AZ – May 15, 2024 – Brewer Science, a global technology leader in specialty materials for…
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