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April 17, 2017 Press Release
Dr. Tony Flaim, Chief Technical Officer, Brewer Science Keynotes at The Advanced Packaging & System Integration Technology Symposium

April 17, 2017 – Wuxi, China– Brewer Science invites you to join us April 21 for the Advanced Packaging & System Integration Technology Symposium in Wuxi, China. Organized by Yole…

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April 24-27, 2017 Event
VLSI-TSA Symposium 2017

April 24-27, 2017 Hsinchu,Taiwan. VLSI-TSA Symposium Ambassador Hotel Hsinchu, Taiwanj The 2017 International Symposium on VLSI Technology, Systems and Applications (2017 VLSI-TSA) will be held on April 24-27, 2017 at the…

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April 20-21, 2017 Event
Advanced Packaging & System Integration Technology Symposium (Yole & NCAP) 2017

April 20-21, 2017 Wuxi, China   The Advanced Packaging Symposium is hosted and organized by Yole Développement and the National Center for Advanced Packaging (NCAP China). All aspects of Advanced…

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March 28-30, 2017 Event
LOPE-C

March 28-30, 2017 Munich, Germany Booth: 510 "High-Current Pulse Processing to Improve Stability and Hysterisis in CNT-based Printed Electronic Devices" Dr. Ryan Giedd Session: Functional Materials March 29th, 2017 |…

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March 21, 2017 Video
[VIDEO] Directed Self-Assembly at Brewer Science

Directed self-assembly (DSA) is an exciting new technology that uses specially designed block copolymers​ to form IC patterns on a molecular scale.

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Mar 12 - 13, 2017 Event
China Semiconductor Technology International Conference (CSTIC)

March 12 - 13, 2017 Shanghai, China Shanghai International Convention Center "Molecular Force Modeling of Lithography" Zhimin Zhu, Senior Scientist, Brewer Science, Inc. - Invited speaker. Symposium II: Lithography and…

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March 07, 2017 Video
Understanding Panel-Level Processing

Understanding Panel-Level Processing Ram Trichur explains how the transition from conventional wafers to large panels can generate significant cost savings for fan-out wafer-level packaging, and how these large, thin panels…

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