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A variety of factors can affect the coat quality when spin processing. This article will focus on the role that the bowl environment, and in particlar the ability to control…
October 15, 2016 Blogs Read MoreProcess application engineers often encounter a variety of complex challenges related to deposition by spin coating, as many variables affect the quality of the spin-applied coating. These variables have critical…
Read MoreFabrication of microelectronic devices increasingly involves the creation of high-aspect-ratio structures (those with large height or depth and narrow width, such as trenches, vias, columns, and mesas). These structures provide…
Read MoreLimitations of Moore's Law Ultimately, performance of computers and other electronic products will be limited by transistor size and density. Because the semiconductor industry has pushed to create ever-smaller features…
Read MoreCost of ownership plays an important role in lithography process materials and methods decisions. Process simplifications brought about by layer-to-layer synergy drive significant cost of ownership advantages for multilayer lithography…
Read MoreOne of the most critical variables in spin-coating processes is coating uniformity. In many cases, engineers are challenged with achieving ultralow total thickness variation at high film thicknesses while conserving…
Read MoreAs semiconductor devices evolve, smaller and smaller feature sizes are required to achieve the performance desired by the consumer. Smaller features give rise to lower power consumption for mobile devices,…
Read MoreAt the Science Café event held at Farmers Gastropub on April 19, James E. (Jim) Lamb III, Brewer Science Corporate Technology Strategist and Director of the Printed Electronics Technology Center,…
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