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The use of immersion tank processes has steadily decreased over the past decade because of drawbacks associated with material consumption, non-uniform resolution, and the lack of agitation necessary for clearing high-aspect-ratio features for MEMS and advanced lithography. Additionally, increased throughput requirements and reduction in critical dimensions (CDs) have further shifted mainstream applications to single-wafer spray/puddle…
Click Here to Read MoreIndustry-leading precision With temperature uniformities measuring within 0.3% across the working surface, Cee® bake plates provide all the necessary precision for critical baking processes. Process flexibility Choose between contact, vacuum, and proximity baking methods, and utilize temperature ramping capabilities for the ultimate in baking process control. Exceptional uptime and reliability Rugged stainless steel construction combined with…
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