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The unsung hero of the next technological generation

As we push to shrink feature sizes and introduce full-scale 3D integration, the substrates on which integrated circuits are printed must obviously become thinner. Much thinner. While shaving down the substrates to less than 100 micrometers thick is a readily available process, moving to even thinner device substrates (<50 µm) makes for an extremely fragile…

  laser release, ultrathin wafers, mechanical release, temporary wafer bonding Click Here to Read More