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Laser Debonding in 2D and 3D Heterogeneous Applications featured in Chip Scale Review

Alice Guerrero, Senior Applications Engineer in Wafer-Level Packaging at Brewer Science, and Koen Kennes, Research and Development Engineer at imec, contributed to Chip Scale Review with a discussion of the fundamentals of laser debonding and the advantages it has for 2D and 3D heterogeneous integration. Brewer Science and imec have several different products and programs…

  brewer science, Wafer-Level packaging, WLP, Chip Scale Review Click Here to Read More

IWLPC (International Wafer-Level Packaging Conference)

October 24-26, 2017 San Jose, CA Double Tree by Hilton San Jose Attend our presentation at Wafer Level Packaging (WLP) Processes Session 4 The Dual-layer Bonding Platform as A Technical Enabler for Wafer-Level Packaging Applications Tuesday, October 24, 2017, 1:00-3:00 pm (Oak) Xiao Liu, Ph.D., Brewer Science Inc Author(s):        Xiao Liu, Qi Wu, Dongshun Bai,…

  Wafer-Level packaging, 2017 Click Here to Read More

3D ASIP

December 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology for Advanced Packaging Session: Equipment and Materials 4:40PM - 5:00PM | Wednesday, December 14th, 2016 Dongshun Bai, Brewer Science Emerging Brewer Science Technologies at 3D…

  2016, Wafer-Level packaging Click Here to Read More
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