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300-mm Ultrathin Wafer Handling: Presentation Highlights High-Temperature-Stable Temporary Bonding and IR Laser Debonding with Si Carriers Chemnitz, Germany. – December 2, 2025 – Brewer Science, in collaboration with EV…
December 02, 2025 Press Release Read MoreBrewer Science Expands U.S. Operations with New Chandler, Arizona Office and Lab Collaboration with semiconductor customers and research partners, access to talent among key considerations CHANDLER, Arizona. –…
Read MoreParticipating in the Next-Generation Semiconductor Packaging Consortium "JOINT3" Brewer Science has joined the next-generation semiconductor packaging consortium "JOINT3." September 3, 2025 - JOINT3 is a co-creation evaluation platform established by…
Read MoreBrewer Science Presents Materials’ Impact in Sustainable Processes, AI, and High-Performance Computing Presentations at SEMICON Taiwan 2025 demonstrate how materials impact sustainability, artificial intelligence, and high-performance computing Taipei, Taiwan…
Read MoreBrewer Science Supports the Restoration of Full R&D Tax Deductibility with the Passage of OBBB Legislation Strengthens U.S. Semiconductor Manufacturing and Innovation Rolla, MO., August 12, 2025—Brewer Science, a…
Read MoreBrewer Science Named 2025 National Top Workplace in Manufacturing Industry Ninth Consecutive Year Receiving 2025 Top Workplace in Greater St. Louis Rolla, MO – August 7, 2025 – Brewer…
Read MoreBrewer Science Presents Materials Innovation for Additive Electronics at TechBlick 2025 Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing Boston, Massachusetts – June 4,…
Read MoreBrewer Science releases Impact Report 2025 Environmental, social and governance efforts detailed in comprehensive report Rolla, MO., May 6, 2025– Brewer Science, a global leader in developing and manufacturing…
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