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Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor industry is also witnessing increasing investments in packaging, in terms of capabilities, capacity, and infrastructure from the assembly and packaging houses. All this attention on packaging is primarily driven by the need to deliver highly…
Click Here to Read MoreImagine an intelligent world where highways formulate warning messages and diversions, retail managers are alerted when a product is low in stock on shelves or cities are able to detect areas where power outages may occur before the event takes place. As technology continues to expand and grow in new directions, artificial intelligence (AI)…
Click Here to Read MoreAccording to the American Trucking Association, there is a shortage of roughly 50,000 truck drivers across the country. In 2017, the ATA predicted the trucking industry would experience the highest level of driver shortfall, and by 2026 the ATA estimates the shortage could swell to over 174,000 drivers. Dr. John Kent, Clinical Associate Professor in…
Click Here to Read MoreArticle published in Chip Scale review's March - April 2018; Volume 22, Number 2 Issue The semiconductor industry is in a new age where device scaling will not continue to provide the cost reductions or performance improvements at a similar rate to past years when Moore’s law was the guiding principle for IC scaling. The…
Click Here to Read MoreProtecting our environment and conserving resources are essential to running a successful and mindful business, but how do you make this part of your organization’s mission and vision? The key to building a culture of environmental responsibility begins with the commitment and support of leadership and engagement of all employees. Engaged employees are a key…
Click Here to Read MoreAccording to the U.S. Energy Information Administration (EIA), U.S. production and consumption of non-hydro renewable energy sources (i.e., biofuels, biomass, geothermal, solar, wind) set new records in the first half of 2018. Of these sources, geothermal, while still relatively nascent in its implementation, holds great promise. Integrating geothermal systems for heating and cooling into a…
Click Here to Read MoreRichard Feynman, who won the Nobel Prize in Physics in 1965, gave a famous lecture titled “There's Plenty of Room at the Bottom.” Today’s microelectronics process engineer, in the context of conventional top down lithography, would find it difficult to accept this statement without a long list of caveats. Aggressive scaling demands for newer generations…
Click Here to Read MoreBrewer Science is headed to the CS ManTech conference May 18 through 21! CS ManTech is a respected organization focused on providing a forum for members of the compound semiconductor community to exchange and discuss new ideas. At this year's conference, we’re excited to share our findings regarding the ability of glass to be used…
Click Here to Read MoreHere at Brewer Science, we are striving to reach zero-landfill status. Our efforts in environmental responsibility include our mini-bin recycling program and our installation of efficient water and electrical fixtures. Our latest environmentally responsible venture involves a large metal container in our parking lot – a trash compactor we’ve affectionately named Big Blue. This large,…
Click Here to Read MoreWe sat down with our engineers to get their insights on where the spin-coating industry is headed. We were met with an overwhelming response identifying the need for data streaming in real time. Although the spin-coating process is considered to be very efficient, there is always room for improvement. Real-time data monitoring and process transparency…
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