| Show Me | All News | Blog | Ebooks | Videos | Press Releases | Events |
|---|
Just because a material is a good substrate for making semiconductors doesn’t mean it will do everything the engineer wants it to do. In fact, surface modification — the act of modifying the surface of a material in a way that will affect its ultimate functioning — is integral to semiconductor manufacturing. The molecules and…
Click Here to Read MoreMore than two months after hurricanes Irma and Harvey battered the Gulf of Mexico and the Caribbean, the U.S. continues to struggle with remediating the destruction. At times like this, the world relies heavily on scientists and engineers for the brainpower and expertise needed to address the huge problems that result. The scientific community is…
Click Here to Read MoreBack in the ‘40s and ‘50s, when computers were just room-sized, relay-based calculators, no one probably thought much about integrating computing technology into automobiles. By 1965, computers were smaller multitaskers running simple software programs, yet the closest they came to automobiles was probably an advertisement that showed the PDP-8, the first minicomputer to enjoy commercial…
Click Here to Read MoreThe essence of biometrics is using physical characteristics that are unique to each individual to identify one person from billions of others in the world. Early biometrics were somewhat low-tech; for example, fingerprinting originally required nothing more than some ink, a magnifying glass and a human who knew how to “read” the prints. Today’s biometrics…
Click Here to Read MoreDirected self-assembly (DSA) refers to the integration of block copolymer (BCP) materials that undergo phase separation with traditional manufacturing processes. With DSA, nanoscale dimensions are achieved at a drastically reduced cost by novel material designs without additional equipment upgrades. Alternative lithographic approaches to achieve features ≤10 nanometers in size typically involve higher equipment budgets or…
Click Here to Read MoreIn previous posts, we’ve made references to Moore’s law and how, with uncanny accuracy, it has predicted that the number of transistors in a dense integrated circuit (IC) would double approximately every two years. The semiconductor industry has tirelessly chased Moore's law ever since it was first coined in the 1970s, but as ICs have…
Click Here to Read MoreFor centuries, humans have tried to harness the seemingly endless power of the sun. And now, it seems like we’re making some big strides. Here are just a few amazing places where solar is really shining. Up on the roof Perhaps the roof isn’t an unlikely place for solar panels to live. Maybe it even…
Click Here to Read MoreA variety of factors can affect the coat quality when spin processing. This article will focus on the role that the bowl environment, and in particlar the ability to control the fume exhaust, has on this process. The drying rate of the resin fluid during the spin process is defined by the nature of the…
Click Here to Read MoreHigh-k metal gate (HKMG) technology has become one of the front-runners for the next generation of CMOS devices. This new technology incorporates a high-k dielectric, which reduces leakage and improves the dielectric constant. To help with fermi-level pinning and to allow the gate to be adjusted to low threshold voltages, a metal gate is used…
Click Here to Read MoreNew lithographic compositions, for use as middle layers in trilayer processes resist processes can be applied as very thin films with a very thin layer of photoresist being applied to the top of the middle layer. Thus, the underlying bottom anti-reflective coating is still protected even though the overall stack (i.e., anti-reflective coating plus middle…
Click Here to Read More