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LOPEC (Large-area, Organic & Printed Electronics Convention) is the leading trade fair and the most important congress for the printed electronics industry. The event usually takes place at Messe Munchen convention center in Germany,but this will be the first year it's held virtually! It is the leading global platform in the industry and provides support…
Click Here to Read MoreSEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China. SEMICON China will be held on March 17-19, 2021 in Shanghai, China, (and virtual) in conjunction with CSTIC…
Click Here to Read MoreCSTIC 2021 is one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Organized by SEMI, IMEC and IEEE-EDS, co-organized by IMECAS. CSTIC 2021 will be held on March 14-15, 2021 in Shanghai, China, in conjunction with SEMICON China 2021. Virtual conference will be held on March…
Click Here to Read MoreFLEX, the flexible hybrid electronics (FHE) go-to event, is the center of technical and informative demonstration of flexible hybrid, printed electronics products, equipment, processes, materials, and the applications they enable. As the premier information-gathering and networking conference for industry stakeholders, and the FHE community, FLEX gathers 550+ executives, product managers, business development professionals, and engineering…
Click Here to Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Industry and academic leaders come to solve challenges in lithography, patterning technologies, and unique materials, while sharing the latest advancements in the semiconductor industry. Check out our virtual booth here. https://youtu.be/B92S2vT4iro
Click Here to Read MoreDr. Brewer presented at Missouri State University's Bicentennial Webinar Series: "Changing Lives Through Technology, Science and Innovation" on January 27th at 12pmCST. If you were unable to attend the virtual event, you can watch a recording here: https://youtu.be/EwuHsMpAlWc
Click Here to Read MoreAlice Guerrero, Senior Applications Engineer in Wafer-Level Packaging at Brewer Science, and Koen Kennes, Research and Development Engineer at imec, contributed to Chip Scale Review with a discussion of the fundamentals of laser debonding and the advantages it has for 2D and 3D heterogeneous integration. Brewer Science and imec have several different products and programs…
Click Here to Read MoreKim Arnold, Chief Development Officer, and Kim Yess, Executive Director of WLP Materials, sat down with SiS to discuss temporary bonding and debonding materials that are enabling next generation semiconductor packaging solutions. The digital magazine is available at Silicon Semiconductor. Brewer Science was featured in Silicon Semiconductors 2020 Magazine - Issue 4.
Click Here to Read MoreOctober 22 & 23 CMC Conference preceded by CMC Meeting at Intel on October 20-21 Featuring Keynote: Bruce Tufts, VP Technology & Manufacturing Group, Director, Fab Materials, Intel Corp with presentations from industry leaders focused on: “The Current and Future Challenges of Critical Materials For Semiconductor Manufacturing” Learn more on the conference website
Click Here to Read MoreBridging the Boundaries: Wafer, Panel and Beyond October 13 - 15, 2020 DoubleTree by Hilton San Jose San Jose, California, USA The SMTA and Chip Scale Review are pleased to announce plans for the 17th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. This premier industry event explores leading-edge design, material, and process technologies being…
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