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Douglas Guerrero will be presenting Roles of Underlayers in Novel Patterning for EUV Lithography, and Zhimin Zhu will be presenting Suppressing Stochastic Interaction to Improve EUV Lithography at CSTIC, one…
June 14th thru July 12th Event Read MoreThe Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment…
Read MoreBrewer Science will be exhibiting at the SMC (Strategic Materials Conference) Korea 2022. Check out our virtual booth to learn more about our innovative approach to EUV lithography. Yichen Liang…
Read MoreHow do manufacturing companies target GHG reduction? Businesses must reduce their environmental impact. One of the most significant ways to do this is by reducing their carbon footprint, and this…
Read MoreBrewer Science Earns Intel’s 2022 EPIC Distinguished Supplier Award Brewer Science is one of only 26 Distinguished Award recipients across Intel’s global supply chain Rolla, MO. April 7, 2022…
Read MoreRama Puligadda will be presenting New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging at the CMC Conference. Brewer Science is a "Coffee Break Sponsor" at this…
Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Jakub Kosa will be presenting, High-temperature stable spin-on carbon…
Read MoreBaron Huang, Mei Dong, Shelly Fowler, Andrea Chacko, and Rama Puligadda contributed to Chip Scale Review with a discussion of Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material.…
Read More• Munich, Germany [+]
June 24, 2025
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