Experience the difference with Brewer Science's revolutionizing technologies. We offer an extensive range of products, from lithography materials to equipment, that impact our everyday lives.
The introduction of BrewerBUILD™ Material offers an industry wide multifunctional solution addressing the challenges associated with redistribution layer (RDL)-first/Chip-last packaging in wafer- or p
BrewerBOND® T1100/C1300 Series Materials enable our unique Dual-Layer solution for high-temperature and high-stress applications found within the semiconductor industry.
Brewer Science’s integrated sensor system is an automated system that enables more predictive analytics.
The biggest problem facing lithographers using EUV is the RLS trade-off: simultaneous improvement of resolution, line width roughness, and photosensitivity.
BrewerBOND® 530 mechanical debonding release material offers additional choices for stronger adhesions necessary for high stress/high temperature temporary bonding applications.
Brewer Science is actively developing materials and processes for the most advanced DSA schemes, including high-χ (high-chi) block copolymers that enable feature sizes of less than 10 nm.
BrewerBOND® 220 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.
OptiStack® multilayer systems are our flagship lithography technology, and are used for leading-edge high volume IC manufacturing.
ProTEK® PSB coating is a spin-on replacement for silicon nitride or silicon oxide wet etch masks
ProTEK® B3 coatings thin films are spin-applied polymeric coating systems that provide temporary wet-etch protection for CMOS MEMS circuitry during alkaline or acid etches.
ARC® anti-reflective coatings are the industry benchmark for reflection control and light absorption during photolithography.
Temporary wafer bonding release material for mechanical debonding applications
This UV laser release material was designed to benefit a variety of temporary bonding, debonding market applications including chip-first/chip-last and RDL-first FOWLP processes.
WaferBOND® HT-10.10 temporary bonding material enables back-end-of-line (BEOL) processing of ultrathin wafers with standard semiconductor equipment
WaferBOND® CR-200 temporary bonding material enables back-end- of-line processing of ultrathin wafers with standard semiconductor equipment
BrewerBOND® 305 temporary wafer bonding material is an organic coating that enables back-end-of-line (BEOL) processing of ultrathin wafers using standard semiconductor equipment.
InFlect™ flex sensors are a revolutionary approach to sensing that deliver highly sensitive, real-time responses to varying angles of deflection.
InFlect™ moisture sensors deliver highly sensitive, real-time responses to changes in moisture critical for process and product protection and are ideal for monitoring low-humidity environments.
Temperature sensors, both InFlectTM thermistor and RTD, enable accurate, real-time responses to small changes in temperature.