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December 13-15, 2017 Booth: 3209 Tokyo, Japan SEMICON Japan: Semiconductor, Wafer-Level Packaging Tokyo, Japan For more information contact us at info@brewerscience.com or fill out the below form: For more information: Conference Website
Click Here to Read MoreDecember 20, 2017 – Springfield, MO - Brewer Science is quadrupling its research operations at Missouri State University’s Roy Blunt Jordan Valley Innovation Center (JVIC) located in Springfield, Missouri. The expansion brings the total footprint at JVIC to approximately 20,000 square feet. “Our researchers continue to lead the way in new discoveries and innovation in…
Click Here to Read MoreDecember 6-9, 2017 Singapore, Grand Copthorne Waterfront Hotel Brewer Science’s Ram Trichur, Business Development Director, to present an invited talk at EPTC: Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes Location: Swallow Room Friday, December 8, 2017 8:30-9:00 am Ram is also moderating the Material and Processing session: Session: S-09, Material and Processing Location: Lyrebird…
Click Here to Read MoreOctober 3rd, 2017 – Springfield, MO - Brewer Science, in cooperation with the Springfield Regional Arts Council and Arts Rolla, will host an exhibit featuring original art and photography at the Creamery Arts Center during the month of October. “Pure Enjoyment,” a juried exhibit, will feature 121 works of original art, photography, and dimensional art…
Click Here to Read MoreOctober 29-November 2, 2017 Tampa, FL Don’t miss our presentation Materials and Methods for Bottom-Up Semiconductor Device Manufacturing by Selective Surface Modification, Reuben Chacko, J. Lowes, J. Dai, S. Brown, D. Sweat, Brewer Science, Inc. 2D Materials Poster Session, November 2, 2017, 6:30 PM Abstract: In order to extend Moore's Law, device makers are looking…
Click Here to Read MoreOctober 24-26, 2017 San Jose, CA Double Tree by Hilton San Jose Attend our presentation at Wafer Level Packaging (WLP) Processes Session 4 The Dual-layer Bonding Platform as A Technical Enabler for Wafer-Level Packaging Applications Tuesday, October 24, 2017, 1:00-3:00 pm (Oak) Xiao Liu, Ph.D., Brewer Science Inc Author(s): Xiao Liu, Qi Wu, Dongshun Bai,…
Click Here to Read MoreOctober 9-12, 2017 Raleigh, NC Attend our joint paper with SUSS MicroTec Ablative Laser Patterning of Polymeric Dielectric Materials Author(s): Cristina Matos, Brewer Science, Inc. (Deborah Blumenshine, Lisa Kirchner, Rama Puligadda; Brewer Science, Inc.; Habib Hichri, Seongkuk Lee, Markus Arendt, Suss MicroTec Group) Wednesday, October 11, 2017, 8:30-8:55 am Abstract: Advances in the research and…
Click Here to Read MoreSeptember 27-29, 2017 Barcelona, Spain Don’t miss the opportunity to attend our Sensors Applications session presentation Sensor Excitation and Measurement Techniques for CNT Thin-Film Sensors Louis McCarthy, Brewer Science Friday, September 29, 2017, 15:45 – 16:00 Abstract: Extracting meaningful data from a high-noise EMI environment can present a challenging task. Converters, line-noise, and high-speed…
Click Here to Read MoreSeptember 13-15, 2017 Tokyo, Japan Sensor Expo Japan: Printed Electronics Tokyo Big Sight - East Hall Organizer： Fuji Sankei Business i. (The Nihon Kogyo Shimbun Co., Ltd.) Special Sponsor： Japan Society of Next Generation Sensor Technology Schedule a time to meet at the conference or ask a question about a featured product: For…
Click Here to Read MoreSept. 13, 2017 – Rolla, MO, USA, and Taipei, Taiwan – Brewer Science, Inc. is pleased to announce its participation in SEMICON Taiwan 2017. The company will share in a knowledge exchange with industry colleagues about semiconductor-manufacturing trends in Taiwan that are emerging in both front- and back-end materials, and process steps for next-generation manufacturing.…
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