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March 11-12, 2018 Shanghai New International Expo Centre Shanghai, China Description: Brewer Science will be presenting at this annual semiconductor technology conference in Shanghai. This is the biggest technology conference in China since 2000. Organized by SEMI, IMEC, and IEEE-EDS, it will be held in conjunction with SEMICON China. Products/Business Unit Information: Lithography and WLP…
Click Here to Read MoreFebruary 25 – March 2, 2018 Booth #: 110 San Jose Convention Center San Jose, California Speaker Information: Presenter: Zhimin Zhu Time: Tuesday, February 27th: 10:30AM – 12:10PM Optical Microlithography Session 2: Advanced Process Control Paper #: 10587-5 Title: High-fidelity lithography against stochastic effects Poster: Nicholas L. Brakensiek, Kui Xu, and Daniel Sweat Time:…
Click Here to Read MoreFebruary 12-15, 2018 Hyatt Regency Monterey, California Description: Flex 2018, a SEMI organization event in collaboration with MEMS & Sensors Technical Congress (MSTC) in Monterey, California, will be the place to be for both technical and business representatives for the sensors industry. Brewer Science will discuss and present their latest printed sensor systems technologies…
Click Here to Read MoreJanuary 28-31, 2018 Messe Munchen Munich, Germany Description: ISPO is the world’s leading sports business trade fair. Gathering the major brands, suppliers, and innovators for sports technology into one area for a week creates a unique environment for the next generation of sports technology. Products/Business Unit Information: InFlect™ Sensors [Moisture, Flex, and Temperature] Speaker Information:…
Click Here to Read MoreDecember 13-15, 2017 Booth: 3209 Tokyo, Japan SEMICON Japan: Semiconductor, Wafer-Level Packaging Tokyo, Japan For more information contact us at info@brewerscience.com or fill out the below form: For more information: Conference Website
Click Here to Read MoreDecember 6-9, 2017 Singapore, Grand Copthorne Waterfront Hotel Brewer Science’s Ram Trichur, Business Development Director, to present an invited talk at EPTC: Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes Location: Swallow Room Friday, December 8, 2017 8:30-9:00 am Ram is also moderating the Material and Processing session: Session: S-09, Material and Processing Location: Lyrebird…
Click Here to Read MoreTuesday, December 5, 2017 San Francisco, CA, USA Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer Handling in an invited talk at 3D ASIP: Tuesday, December 5, 2017 SESSION 3 Equipment & Materials 5:00pm-5:20pm Check out the program agenda here. 3D…
Click Here to Read MoreOctober 29-November 2, 2017 Tampa, FL Don’t miss our presentation Materials and Methods for Bottom-Up Semiconductor Device Manufacturing by Selective Surface Modification, Reuben Chacko, J. Lowes, J. Dai, S. Brown, D. Sweat, Brewer Science, Inc. 2D Materials Poster Session, November 2, 2017, 6:30 PM Abstract: In order to extend Moore's Law, device makers are looking…
Click Here to Read MoreOctober 24-26, 2017 San Jose, CA Double Tree by Hilton San Jose Attend our presentation at Wafer Level Packaging (WLP) Processes Session 4 The Dual-layer Bonding Platform as A Technical Enabler for Wafer-Level Packaging Applications Tuesday, October 24, 2017, 1:00-3:00 pm (Oak) Xiao Liu, Ph.D., Brewer Science Inc Author(s): Xiao Liu, Qi Wu, Dongshun Bai,…
Click Here to Read MoreOctober 9-12, 2017 Raleigh, NC Attend our joint paper with SUSS MicroTec Ablative Laser Patterning of Polymeric Dielectric Materials Author(s): Cristina Matos, Brewer Science, Inc. (Deborah Blumenshine, Lisa Kirchner, Rama Puligadda; Brewer Science, Inc.; Habib Hichri, Seongkuk Lee, Markus Arendt, Suss MicroTec Group) Wednesday, October 11, 2017, 8:30-8:55 am Abstract: Advances in the research and…
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