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Brewer Science to Showcase Advanced Material Innovations at CS MANTECH and ECTC 2025 Enabling 3D integration requires strategic temporary bonding material selection Rolla, Mo. – May 14, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, will present innovations in temporary bonding materials at two premier conferences this…
Event Read MorePresentation Friday, June 3rd · 2:20PM Session 36: 3D materials & Processing Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material" Alain Phommahaxay, Goedele…
Read MoreCompound Semiconductor Manufacturing 2016 See the next generation of temporary bonding equipment and thin wafer handling technology for SiC and compound semiconductor at the Brewer Science 2016 CS Mantech booth.…
Read MoreOctober 24-26, 2016 Hiroshima, Japan http://euvl2016.org/ Please look for Tanti Ouattara's poster at 2016 International EUVL Symposium.
Read MoreBest Practices for Virtual Internships Webinar Julie Littrell, Sr. HR Director at Brewer Science, joins a webinar discussing how employers can offer virtual internships and the benefits it carries Watch…
Read MoreBrewer Science participated in the 2020 IEEE 70th Electronic Components and Technology Conference (ECTC). Xiao Liu, Senior Program Manager at Brewer Science, presented 'Introduction of a New Carrier System for…
Read MoreAlice Guerrero, Senior Applications Engineer in Wafer-Level Packaging at Brewer Science, and Koen Kennes, Research and Development Engineer at imec, contributed to Chip Scale Review with a discussion of the…
Read MoreChief Resource Officer Dan Brewer Set to Deliver Keynote Speech at Tech and Innovation Summit Remarks Highlight Missouri's Robust Technological Advancements https://youtu.be/hMrs2M_Oeko ROLLA, Mo., Aug. 18, 2021 -- Brewer…
Read More2021 Brewer Science Hosts Pure Enjoyment Art Exhibit Virtual and In-Person [caption id="attachment_8670" align="alignright" width="193"] Forest Greens - Morgan Bippes[/caption] Springfield, MO - November 1, 2021 – Brewer Science, in…
Read MoreBaron Huang, Mei Dong, Shelly Fowler, Andrea Chacko, and Rama Puligadda contributed to Chip Scale Review with a discussion of Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material.…
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