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Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material featured in Chip Scale Review

Baron Huang, Mei Dong, Shelly Fowler, Andrea Chacko, and Rama Puligadda contributed to Chip Scale Review with a discussion of Wafer-level polymer/metal hybrid bonding using a photosensitive permanent bonding material.…

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Brewer Science presents EUV lithography innovation at largest tech conference in Asia

Brewer Science presents EUV lithography innovation at largest tech conference in Asia Roles of underlayers in EUV lithography is the keynote speech at CSTIC 2022   Rolla, Mo. June 20,…

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Brewer Science Expands Vichy Manufacturing Center to Support Semiconductor Growth

Vichy, Missouri - August 15, 2023 - Brewer Science, a global leader in developing and manufacturing next-generation materials and products for the semiconductor industry, is thrilled to announce the expansion…

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Brewer Science hosts 21st annual Pure Enjoyment Art Show

November 6, 2023 – Springfield, MO - Brewer Science, in cooperation with the Springfield Regional Arts Council, hosted an exhibit featuring original art and photography during October. “Pure Enjoyment” featured…

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Brewer Science presents innovative materials and processes at SPIE Advanced Lithography Conference 2024

Brewer Science presents innovative materials and processes at SPIE Advanced Lithography Conference 2024   San Jose, CA  –  February 21, 2024  – Brewer Science, Inc., a global leader in developing…

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