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Tuesday, December 5, 2017 San Francisco, CA, USA   Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer Handling in an invited talk at 3D ASIP: Tuesday, December 5, 2017 SESSION 3 Equipment & Materials 5:00pm-5:20pm Check out the program agenda here. 3D…

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Brewer Science presents at 3D ASIP

December 07, 2016 – San Francisco, CA – Brewer Science is pleased to announce that Dr. Dongshun Bai, Senior Program Manager, will be speaking on new temporary wafer bonding technology at the 13th Annual 3D ASIP. This event, which will be held, December 13 through 15 in San Francisco, CA, is recognized as the principal…

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