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Advanced Materials: Disrupting an Industry

The more things change, the more they stay the same. No, we're not talking about our favorite Bon Jovi lyrics. We're talking about semiconductor manufacturing. The technology industry changes almost in front of our eyes. The raw materials we're using, however, haven't really changed much over the last couple of decades. Basically, our palette is…

  advanced materials, disruptive materials, Strategic Materials Conference, semi, Wafer-Level packaging, SMC Click Here to Read More

Defining an Industry: The evolution of Wafer-Level Packaging at Brewer Science

Much of the semiconductor industry is familiar with Brewer Science as the inventor and leader of the bottom anti-reflective coating (BARC) revolution. Since being established in 1981, Brewer Science has continued to be the market leader in supplying total solutions for enabling lithographic processes pushing beyond Moore’s Law. What many may not realize is that…

  Wafer-Level packaging, company Click Here to Read More

How can glass survive rigorous back end processes?

Brewer Science is headed to the CS ManTech conference May 18 through 21!  CS ManTech is a respected organization focused on providing a forum for members of the compound semiconductor community to exchange and discuss new ideas. At this year's conference, we’re excited to share our findings regarding the ability of glass to be used…

  temporary bonding materials, back-end processes, CTE, CSAM, CS Mantech, Wafer-Level packaging, Corning Click Here to Read More

Temporary Bonding and the Importance of Thermal Stability

Noted author and futurist Ray Kurzweil wrote back in 2001, "We won’t experience 100 years of progress in the 21st century — it will be more like 20,000 years of progress. . . ." From the invention of the first integrated circuit in 1958, technology has evolved at an unbelievable rate, and, as Kurzweil suggests, that won't…

  Wafer-Level packaging, Temporary Bonding, Ray Kurzweil, Thermal Stability Click Here to Read More

Where is the spin-coating industry headed?

We sat down with our engineers to get their insights on where the spin-coating industry is headed. We were met with an overwhelming response identifying the need for data streaming in real time. Although the spin-coating process is considered to be very efficient, there is always room for improvement. Real-time data monitoring and process transparency…

  processing equipment, cee, spin coaters, Wafer-Level packaging Click Here to Read More

Solutions to Manufacturing's Water Problem

  You show me someone who lives in a low-lying area and I’ll show you someone who understands how damaging water can be. Water is essential to all life here on earth. The planet is mostly water. Our bodies are mostly water. Life as we know it would not exist were it not for the…

  Sensors, Wafer-Level packaging, moisture sensors, inflect sensors, wafer problems Click Here to Read More

Wafer-Level Packaging and the Mobile Revolution

Back in September and this past March, Apple held its biannual Special Events. These events are meant to introduce new products and features, and they happen quite regularly. These two recent events, however, seemed to leave something out: computers. September’s presentation was over two hours long and didn’t once mention the flagship devices that put…

  Wafer-Level packaging, FOWLP, Integrated Circuits, 2d, 3d Click Here to Read More

Embedded Wafer-Level Ball Grid Array

The terms "quantity" and "quality" are often discussed in "either/or" scenarios. On one side, you get a lot of something. On the other side, you get the best of something else. In these scenarios, you can't have both, at least not at the same time. In the semiconductor industry, there is constant innovation and limit…

  eWLB, embedded wafer-level, debonding, grid array, Wafer-Level packaging, 3D Stacking Click Here to Read More

IWLPC (International Wafer-Level Packaging Conference)

October 24-26, 2017 San Jose, CA Double Tree by Hilton San Jose Attend our presentation at Wafer Level Packaging (WLP) Processes Session 4 The Dual-layer Bonding Platform as A Technical Enabler for Wafer-Level Packaging Applications Tuesday, October 24, 2017, 1:00-3:00 pm (Oak) Xiao Liu, Ph.D., Brewer Science Inc Author(s):        Xiao Liu, Qi Wu, Dongshun Bai,…

  Wafer-Level packaging, 2017 Click Here to Read More

3D ASIP

December 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology for Advanced Packaging Session: Equipment and Materials 4:40PM - 5:00PM | Wednesday, December 14th, 2016 Dongshun Bai, Brewer Science Emerging Brewer Science Technologies at 3D…

  2016, Wafer-Level packaging Click Here to Read More
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