Dr. Terry Brewer’s discovery of anti-reflective coatings resulted in a revolution in the global microelectronics industry and ushered in today’s high-speed, lightweight electronic devices.
Learn MoreAdvanced materials for the protection and enhancement of optics, displays, and other microelectronics.
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Learn MoreBrewer Science is revolutionizing packaging solutions with innovative bonding and debonding technologies.
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Brewer Science will present at NextFlex Workshop: Hybrid Electronics for Automotive and Aerospace Applications on October 15 – 16, 2025 in Huntsville, Alabama. Dr. Adam Scotch will present Building Circuits from the Ground Up: Materials Innovation for Additive Electronics on October 16 at 8:30am CST, during Session 4: Industrial Capabilities & Needs for Next Gen…
Event Read MoreJanuary 28-31, 2018 Messe Munchen Munich, Germany Description: ISPO is the world’s leading sports business trade fair. Gathering the major brands, suppliers, and innovators for sports technology into one area…
Read MoreDecember 13-15, 2017 Booth: 3209 Tokyo, Japan SEMICON Japan: Semiconductor, Wafer-Level Packaging Tokyo, Japan For more information contact us at info@brewerscience.com or fill out the below form: For more information:…
Read MoreDecember 6-9, 2017 Singapore, Grand Copthorne Waterfront Hotel Brewer Science’s Ram Trichur, Business Development Director, to present an invited talk at EPTC: Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes…
Read MoreTuesday, December 5, 2017 San Francisco, CA, USA Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer…
Read MoreOctober 29-November 2, 2017 Tampa, FL Don’t miss our presentation Materials and Methods for Bottom-Up Semiconductor Device Manufacturing by Selective Surface Modification, Reuben Chacko, J. Lowes, J. Dai, S. Brown,…
Read MoreOctober 24-26, 2017 San Jose, CA Double Tree by Hilton San Jose Attend our presentation at Wafer Level Packaging (WLP) Processes Session 4 The Dual-layer Bonding Platform as A Technical…
Read MoreOctober 9-12, 2017 Raleigh, NC Attend our joint paper with SUSS MicroTec Ablative Laser Patterning of Polymeric Dielectric Materials Author(s): Cristina Matos, Brewer Science, Inc. (Deborah Blumenshine, Lisa Kirchner, Rama…
Read MoreSeptember 27-29, 2017 Barcelona, Spain Don’t miss the opportunity to attend our Sensors Applications session presentation Sensor Excitation and Measurement Techniques for CNT Thin-Film Sensors Louis McCarthy, Brewer Science…
Read MoreTaipei Nangang Exhibition Center Taipei, Taiwan Booth 280 Join Brewer Science at the largest microelectronic event in Taiwan Brewer Science is proud to be a part of the largest microelectronic…
Read MoreSeptember 13-15, 2017 Tokyo, Japan Sensor Expo Japan: Printed Electronics Tokyo Big Sight - East Hall Organizer: Fuji Sankei Business i. (The Nihon Kogyo Shimbun Co., Ltd.) Special…
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