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Brewer Science presents Materials Innovation for Additive Electronics at InterPACK 2024 Building Circuits from the Ground Up: Domestic Advanced Packaging Relies on Additive Manufacturing San Jose, California – October 2, 2024 – Brewer Science, Inc., a global leader in advancing innovative materials needed for additive electronics, is presenting Building Circuits from the Ground Up:…
Event Read MoreJanuary 8-11, 2017 Half Moon Bay, California Brewer Science is proud to sponsor two sessions at the 2017 SEMI ISS. The first is the keynote session entitled ‘Data Center: Innovation,…
Read MoreDecember 14-16, 2016 Tokyo, Japan Booth: 3408 SEMICON Japan is the premier exposition for microelectronics manufacturing supply chain. Brewer Science products will be on display at our booth. Emerging Brewer Science…
Read MoreDecember 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology…
Read MoreNovember 16-17, 2016 Santa Clara, California Booth: T19 Presentation: Carbon Nanomaterials: Defining the Future of High-Speed Printed Sensors Time: November 16th, 2016 | 13:55 - 14:15 By: Nick Anthony and Rob Frueh…
Read MoreOctober 30- November 2nd, 2016 Orlando, Florida http://ieee-sensors2016.org/ Come check out our InflectTM sensors demos at booth 12
Read MoreOctober 11-13, 2016 Leti Grenoble, France http://www.dsasymposium.org/index.php/homepage/venue This symposium on directed self-assembly (DSA) will be held in Grenoble, France and will include presentations and exhibits featuring materials, processing, DSA-friendly design,…
Read MoreSeptember 28th, 2016 Fayetteville, Arkansas
Read MoreSeptember 27th, 2016 Rolla, Missouri
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