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Brewer Science to Showcase Advanced Packaging Materials and Technologies at ECTC 2026 Orlando, Florida – May 18, 2026 — Brewer Science, Inc., a global leader in materials innovation for advanced packaging and semiconductor manufacturing, will be exhibiting and presenting at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), taking place May 26–29, 2026,…
Event Read MoreMay 7-10, 2018 Hyatt Regency Austin, Texas Description: The 2018 CS MANTECH Conference will be held in Austin, Texas, May 7-10 and is comprised of technical papers, talks, workshops,…
Read MoreMarch 14-16, 2018 Shanghai New International Expo Centre Shanghai, China Booth #: Brewer Science Booth: #2635 Nissan Chemical Booth: #2531 Description: SEMICON China is one of the fastest growing SEMI…
Read MoreMarch 13-15, 2018 Messe München Munich, Germany Booth #: 303 Description: For the second year in a row, Brewer Science will be exhibiting at LOPEC – International Exhibition and Conference…
Read MoreMarch 11-12, 2018 Shanghai New International Expo Centre Shanghai, China Description: Brewer Science will be presenting at this annual semiconductor technology conference in Shanghai. This is the biggest technology conference…
Read MoreFebruary 25 – March 2, 2018 Booth #: 110 San Jose Convention Center San Jose, California Speaker Information: Presenter: Zhimin Zhu Time: Tuesday, February 27th: 10:30AM – 12:10PM Optical Microlithography…
Read MoreFebruary 12-15, 2018 Hyatt Regency Monterey, California Description: Flex 2018, a SEMI organization event in collaboration with MEMS & Sensors Technical Congress (MSTC) in Monterey, California, will be the…
Read MoreJanuary 28-31, 2018 Messe Munchen Munich, Germany Description: ISPO is the world’s leading sports business trade fair. Gathering the major brands, suppliers, and innovators for sports technology into one area…
Read MoreDecember 13-15, 2017 Booth: 3209 Tokyo, Japan SEMICON Japan: Semiconductor, Wafer-Level Packaging Tokyo, Japan For more information contact us at info@brewerscience.com or fill out the below form: For more information:…
Read MoreDecember 6-9, 2017 Singapore, Grand Copthorne Waterfront Hotel Brewer Science’s Ram Trichur, Business Development Director, to present an invited talk at EPTC: Invited-08: Temporary Bonding Materials for Fan-out Packaging Processes…
Read MoreTuesday, December 5, 2017 San Francisco, CA, USA Brewer Science’s Kim Yess, Business Technology Director, Wafer-Level Packaging Materials Division, to discuss The Evolution of Substrate Build-up and Thin Wafer…
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