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Brewer Science to Showcase Advanced Packaging Materials and Technologies at ECTC 2026 Orlando, Florida – May 18, 2026 — Brewer Science, Inc., a global leader in materials innovation for advanced packaging and semiconductor manufacturing, will be exhibiting and presenting at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), taking place May 26–29, 2026,…
Event Read MoreSeptember 28th, 2016 Fayetteville, Arkansas
Read MoreSeptember 27th, 2016 Rolla, Missouri
Read MoreSeptember 20-21, 2016 Computer History Museum Mountain View, California http://www.semi.org/en/node/41386 The theme for this year’s Strategic Materials Conference (SMC) is Scaling Challenges: The Future of Materials and Packaging. What is…
Read MoreAugust 21-25, 2016 Philadelphia, Pennsylvania
Read MoreJuly 12-14, 2016 Moscone Center San Francisco, California SEMICON West is an annual event built around keeping up with the latest disruptive trends driving today’s market. This event brings…
Read MoreJune 12-15, 2016 Salt Lake City, Utah
Read MorePresentation Friday, June 3rd · 2:20PM Session 36: 3D materials & Processing Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material" Alain Phommahaxay, Goedele…
Read MoreCompound Semiconductor Manufacturing 2016 See the next generation of temporary bonding equipment and thin wafer handling technology for SiC and compound semiconductor at the Brewer Science 2016 CS Mantech booth.…
Read MoreMay 12, 2026
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