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Brewer Science to Showcase Advanced Packaging Materials and Technologies at ECTC 2026 Orlando, Florida – May 18, 2026 — Brewer Science, Inc., a global leader in materials innovation for advanced packaging and semiconductor manufacturing, will be exhibiting and presenting at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC), taking place May 26–29, 2026,…
Event Read MoreBrewer Science presents EUV lithography innovation at Fujifilm Advanced Lithography Workshop in Germany Brewer Science will be presenting at the Fujifilm Advanced Lithography Workshop in Desden, Germany on 15 September…
Read MoreCome visit Brewer Science's booth (J2242) at SEMICON Taiwan, September 14 - 16, 2022 SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also…
Read MoreBrewer Science is exhibiting at the Innovations Festival: Printed, Hybrid, 3D, InMold, Textile Electronics The Largest Online Gathering of the Printed Electronics Community Visit Brewer Science Virtual Booth 24 June |…
Read MoreMatthew Beard, Director of Integrated Management Systems at Brewer Science, shares his expert insight creating sustainability strategies and implementing environmental programs in the semiconductor industry. Join us for this…
Read MoreDouglas Guerrero will be presenting Roles of Underlayers in Novel Patterning for EUV Lithography, and Zhimin Zhu will be presenting Suppressing Stochastic Interaction to Improve EUV Lithography at CSTIC, one…
Read MoreThe Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment…
Read MoreBrewer Science will be exhibiting at the SMC (Strategic Materials Conference) Korea 2022. Check out our virtual booth to learn more about our innovative approach to EUV lithography. Yichen Liang…
Read MoreShelly Fowler will be presenting, A Novel Photosensitive Permanent Bonding Material Designed for Polymer/Metal Hybrid Bonding Applications at CS Mantech. She will be apart of session 12: Integrations & Packaging…
Read MoreRama Puligadda will be presenting New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging at the CMC Conference. Brewer Science is a "Coffee Break Sponsor" at this…
Read MoreAs the primary global lithography event, the SPIE Advanced Lithography technical program focuses on works in optical lithography, metrology, and EUV. Jakub Kosa will be presenting, High-temperature stable spin-on carbon…
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