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Brewer Science will present at NextFlex Workshop: Hybrid Electronics for Automotive and Aerospace Applications on October 15 – 16, 2025 in Huntsville, Alabama. Dr. Adam Scotch will present Building Circuits from the Ground Up: Materials Innovation for Additive Electronics on October 16 at 8:30am CST, during Session 4: Industrial Capabilities & Needs for Next Gen…
Event Read MoreApril 20-21, 2017 Wuxi, China The Advanced Packaging Symposium is hosted and organized by Yole Développement and the National Center for Advanced Packaging (NCAP China). All aspects of Advanced…
Read MoreMarch 28-30, 2017 Munich, Germany Booth: 510 "High-Current Pulse Processing to Improve Stability and Hysterisis in CNT-based Printed Electronic Devices" Dr. Ryan Giedd Session: Functional Materials March 29th, 2017 |…
Read MoreMarch 12 - 13, 2017 Shanghai, China Shanghai International Convention Center "Molecular Force Modeling of Lithography" Zhimin Zhu, Senior Scientist, Brewer Science, Inc. - Invited speaker. Symposium II: Lithography and…
Read MoreMarch 7-8, 2017 Brussels, Belgium Ulrich Herleb "A Novel Approach To How The World Senses: Highly Sensitive, Real-time Response, Light-weight And Flexible Sensor Systems Tuesday, March 7, 2017 14:50…
Read MoreFebruary 28- March 2, 2017 San Jose, California Booth: 110 Molecular force modeling of lithography - Invited Paper Zhimin Zhu, Brewer Science, Inc. (United States) Session 4: 3D Resist Effects…
Read MoreFebruary 15- 17, 2017 Tokyo, Japan Brewer Science is co-exhibiting with OE-A (Organic and Printed Electronics Association). Booth: 6B-28 Conference Website
Read MoreJanuary 8-11, 2017 Half Moon Bay, California Brewer Science is proud to sponsor two sessions at the 2017 SEMI ISS. The first is the keynote session entitled ‘Data Center: Innovation,…
Read MoreDecember 14-16, 2016 Tokyo, Japan Booth: 3408 SEMICON Japan is the premier exposition for microelectronics manufacturing supply chain. Brewer Science products will be on display at our booth. Emerging Brewer Science…
Read MoreDecember 13-15, 2016 San Francisco, CA Brewer Science will be presenting at the 13th Annual 3D Architectures for Semiconductor Integration and Packaging in San Francisco, California. Presentation: Temporary Wafer Bonding Technology…
Read MoreNovember 16-17, 2016 Santa Clara, California Booth: T19 Presentation: Carbon Nanomaterials: Defining the Future of High-Speed Printed Sensors Time: November 16th, 2016 | 13:55 - 14:15 By: Nick Anthony and Rob Frueh…
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